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2020다이어리
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디지털 컨버전스 혁신기술 300트랜드
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805쪽 | A3
ISBN-10 : 8994613099
ISBN-13 : 9788994613093
디지털 컨버전스 혁신기술 300트랜드 중고
저자 김원대 | 출판사 비아이알
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2010년 11월 25일 출간
제품상태
상태 최상 외형 최상 내형 최상

[상태 상세 항목] 선택 해당 사항있음 미선택 해당 사항없음

1.외형 상세 미선택 낙서 미선택 얼룩 미선택 접힘 미선택 낙장(뜯어짐) 미선택 찢김 미선택 변색 미선택 제본불량 미선택 부록있음 [출간 20101122, 판형210x297(A4), 쪽수 804]

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(신간) 디지털 컨버전스 혁신기술 300 트랜드 - [중고 아닌 새책입니다.]

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318 잘 받았습니다. cd 누락되었을까봐 걱정이 조금 되었는데 빠짐없이 잘 왔습니다. 5점 만점에 5점 lani5*** 2019.12.14
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상품구성 목록

한국첨단산업연구원 원장 김원대가 편저한 『디지털 컨버전스 혁신기술 300트랜드』. 디지털 컨버전스 중에서도 시스템 온 칩에 관련된 최근 기술개발 동향을 파악한 다음, 새로운 기술혁신 아이디어를 발굴해내도록 300트랜드를 소개하고 있다. 자신의 지식이나 아이디어를 보탬으로써 독자적 기술개발 방향의 설정과 새로운 연구개발 테마의 도출, 그리고 국제협력 대상 기업의 선정 등에 유용하게 활용하게 된다.

저자소개

목차

1. 3Plus1 Technology, First-
Generation Programmable Multicore CoolEngines
2. Abilis Systems, OFDM Demodulator
3. Actel Corporation, Next generation flash-based customizable SoCs
4. Actions Semiconductor Co., New generation of video technology
5. Advantest Corporation,
New Low-Cost Consumer Device SoC Test Solution
6. Advantest, T2000 open-architecture SoC Test System
7. AeroComm Inc., ZB2430 "ZigBee Your Way(TM)" Transceiver
8. GoldenGate software for Advanced RFIC Development
9. AltaSens, Inc., BitsDReam(TM) Technology
10. Altera Corporation, Programmable logic solutions
11. Ambarella Inc., A1 digital camera platform
12. Ambric, Structured Object Programming Model (SOPM)
13. AMD(Advanced Micro Devices), 차세대 프로세서 코어 디자인
14. Platform Solutions for Next Generation Computing Products
15. AMIS Ultra-low Power Wireless ASIC System-on-Chip Solution
16. AltaSens, Inc., AltaChrome imaging System-on-Chip Sensors
17. Analog Devices, Inc., Mixed-signal and Digital Signal Processing ICs
18. Platform solutions for Chip-Package-System convergence
19. Applied Materials, Inc.
20. Next-generation PacketPro Multicore
Processor System-on-a-Chip Family
21. Applied Micro Circuits Corporation, Dual-core Titan, Software
Compatible with AMCC's PowerPC 440 family
22. Aptina, Automotive-Grade Imaging SoC
23. Aptina, A-Pix Technology
24. Aptina Imaging, 5-Megapixel SoC
25. Arada Systems, WLAN-Based RFID Solution
26. ARC International plc,
Configurable processors and multimedia subsystems
27. ARC International, Dynamic Adaptive Encoding
28. ARC International, Configurable Processor Technology
29. ArchPro, Next-Generation Multi-Voltage Verification Solution
30. Arkados, Reliable delivery of multimedia content
31. Arkados, Direct-to-Speaker(tm) Internet Radio Reference Design
32. Arkados, System-on-Chip Powers Digital Audio
33. ARM, Mali(TM) graphics processor architecture
34. ARM, Ultra Low-Power Physical IP Technology
35. ARM, Mali(TM)-200 and Mali-55 cores
36. Aristos Logic, Multi-Protocol RAID Storage Processor Device
37. Arteris, Inc., Network-on-Chip (NoC)
38. Arteris SA, Network-on-Chip (NoC)
39. Arteris, SystemC Transaction Level Models (TLM)
40. AsicAhead NV, AA1001 Worldwide WiMAX Radio
41. AsicAhead NV, Breakthrough Single-Chip Programmable Radio
42. Atheros Communications, Inc.
43. Aviza Technology, Inc.,
Next-generationatomic layer deposition (ALD) system
44. Avnera Corporation, Multipoint HD Wireless Audio Platform
45. Avnera Corporation, Flagship AudioMagic Chips
46. Avnera Corporation,
"Wired-Quality" Wireless Music and Voice Chip Technology
47. AXCESS International Inc., Dual-active RFID technology
48. Axxcelera Broadband Wireless, Sequans System on Chip (SoC)
49. BIOIDENT Technologies Inc., First Complete Lab-on-a-Chip
System Based on Printed Semiconductor Technology
50. Bluespec, Inc., Bluespec high-level synthesis toolset
51. Broadcom Corporation,
Satellite set-top box system-on-a-chip solution
52. Broadcom Corporation,
Breakthrough '3G Phone-on-a-Chip' Processor
53. BroadLight, BL2901 GPON PHY (GPHY) ASIC
54. Cadence Design Systems, Inc., Cortex-A15 processor-based SoCs
55. Calypto Design Systems,
Automated Tool for Memory Power Optimization
56. Carbon Design Systems,
High-performance virtual system prototyping solution
57. Cavium Networks, Next Generation
OCTEON II Multi-Core MIPS64 Internet Application Processor
58. Cavium Networks,
New Highly Integrated Single and Dual Core MIPS64 Processors
59. CebaTech Inc, Breakthrough ESL technology
60. Celeno Communications, WiFi System on a Chip
61. Centillium Communications, Inc.,
eXtremeVDSL2 System-on-a-Chip Solution
62. Centillium Communications, Inc., Entropia VoIP Solution
63. Chipcon AS, ZigBee(TM) Compliant System-on-Chip Solutions
64. Chipcon AS, CC1110 System-on-Chip (SoC) solution
65. Chipidea, Next-Generation USB IP
66. Christie, Brilliant3D(TM) technology
67. Cobra Digital, Cobra PET Portable Media Player
68. Commex Technologies Ltd.,
Vulcan family of NICs - the Vulcan SP HT6210
69. Conexant Systems, Inc., New System-on-Chip (SoC) Controller
70. Conexant Systems, Inc., Passive Optical Networks를 통해 차세대
Triple-Play Services를 가능하게 하는 혁신적 Controllers
71. Coresonic AB, Multimode Wireless Modems
72. Coronis Systems, Next Generation Ultra-Low-Power,
Long Range Wavenis System-on-Chip Solution
73. CoWare, Comprehensive ESL Design Environment
74. Crocus Technology,
Thermally Assisted Switching (TAS)-based MRAM Technology
75. CPU Technology, Inc., SuperQ X3(TM)
76. CSR plc, Auto-qualified SoC Product,
Breakthrough Connected Infotainment Solution
77. CSR, RF CMOS technology
78. Cypress Semiconductor Corp.,
EZ-Color(TM) HBLED Controller Family
79. Cypress Semiconductor Corp.,
High-performance, Mixed-signal, Programmable solutions
80. Cypress Semiconductor Corp., PSoC(R) Mixed-Signal Array
81. D2 Technologies, Android(TM) and Linux Operating Systems
82. DAFCA Incorporated, Leading Edge SoC Verification Solutions
83. DecaWave, Real Time Location Systems (RTLS)
84. Denali Software, Inc., MMAV 2008 Verification IP
85. Denali Software, Inc., PureSpec(TM) Verification Software
86. Dialog Semiconductor Plc, Windows Mobile Based Devices
87. Digium, Inc., VoiceBus(TM) Technology
88. DivX, Inc., World's First DivX Certified Blu-ray Chip
89. DSP Group, Inc., XpandR platform
90. Dynamic Card Solutions, CardWizard software
91. ECS EliteGroup, Mobile WiMAX/EDGE Device
92. Emulex Corporation, InSpeed SOC 422
93. EnCentrus Systems Inc., Next generation OpenCable(TM) products
94. Enea, OSE Real-Time OS
95. ESI, Thin-Film-on-Silicon (TFOS) Laser Trimming Systems
96. eSilicon Corporation, eFlex™ content-addressable memory (CAM)
cores and eFlexCAM™ compilers
97. Faraday Technology Corporation, Low Power Mobile Platform
98. Firetide, Inc., New MIMO Technology
99. FormFactor, Inc., New MEMS probing contact technology
100. Fortinet, FortiWifi(TM)-60C - new multi-threat security appliances
101. Freescale Semiconductor, Breakthrough MSC7120 SoC
102. Fresco Microchip Inc., Low Power Single-Chip Hybrid Receiver
103. Fujitsu Microelectronics Limited, 28-nanometer (nm)
process technology
104. Fujitsu Microelectronics America, Inc.,
Integrated Flexible WiMAX SoC
105. Fujitsu Microelectronics America, Inc., RFCMOS devices용 SoC
106. Fujitsu Semiconductor America, Inc.,
Breakthrough 3D imaging technology
107. GateRocket, Inc,
Verification and debug solutions for advanced FPGAs
108. GCT Semiconductor, WiMAX Single-chip Powers
109. Genesis Microchip Inc.,
Breakthrough Faroudja Quality Video Processing
110. Global Unichip Corp.,
Hardened Versions of Diamond Standard Series Processors
111. IBM, UNIX Virtualization Exclusive
112. IBM, Viability of 3-D Chip Stacking Technique
113. IBM, World's Fastest On-Chip Dynamic Memory Technology
114. IBM, 90-nanometer (nm)
Chips for mobile telecommunications technologies
115. IBM, Breakthrough "Energy-Smart" Business Computing Systems
116. IMEC, Cutting-Edge CMOS Processes
117. ImmenStar, Inc., MuLan(TM) EPON Switch Chipset
118. Impinj, Inc., Multiple-time Programmable AEON(R)/MTP Memory
119. Infineon Technologies AG, Next-generation hard disk drive (HDD)
120. Infineon Technologies AG, First Dual-Band RF-CMOS
Transceiver Core
121. Innovation Quest Inc., ADSL / Wireless Communication
122. InPA Systems, Inc., Active Debug(TM) for Rapid Prototyping
123. Intel Technology, Atom(TM) processor CE4100
124. Intel Corporation, First IA System on Chip for Consumer Electronics
125. Intelligent Automation Corp,
Revolutionary Advancement in Diagnostic Technology, SuperHUMS
126. Intematix Corp., Amber-color LED
127. InterSense Inc., NavChip(TM)-
Breakthrough IMU Chip for Navigation
128. IPextreme Inc., Breakthrough embedded memory
129. Jazz Semiconductor, Inc., RF models and design kits
130. Kilopass Technology Inc.,
Largest Embedded Logic Non-Volatile Memory
131. Kimotion, Calibrated behavioral modeling techniques
132. Lantiq, GPON (Gigabit Passive Optical Network)
System-on-Chip (SoC)
133. Lattice Semiconductor, Extreme Performance LatticeSC
134. Liga Systems, Inc, NitroSIM(TM)
135. Lightspeed Logic,
LTA90, Standard Cell Based Reconfigurable Logic IP
136. Lilliputian Systems(TM), Inc., Fuel Cell on a Chip(TM) Technology
137. LocoLabs, Palm-Sized Development Platform
138. LogicVision, Inc., Serial RapidIO(R) Switches
139. LSI Corporation, Next-Generation High-Capacity Hard Disk Drives
140. LSI Corporation,
PowerPC(TM) 476FP and high-speed embedded DRAM cores
141. LSI Corporation, MegaRAID(R) technology
142. LTX-Credence Corporation, Diamond Test Systems
143. Luxtera, Next-Generation Optical Interconnects
144. Lyrtech Inc., Small Form Factor (SFF)
Software Defined Radio (SDR) Development Platform
145. Magma Design Automation Inc., FineSim(TM) SPICE
146. Marvell, 3D Blu-ray playback integrated in the ARMADA(TM) 1000
147. Marvell, World's First WLAN Plus Bluetooth Single Chip Solution
148. Mentor Graphics Corporation, Olympus-SoC(TM)
Product for Multi-Corner, Multi-Mode (MCMM) Design
149. Mentor Graphics Corporation, Questa(R) Multi-view Verification
Components product/inFact(TM) intelligent testbench automation tool
150. Mentor Graphics Corporation, ADiT Fast-SPICE Technology
151. Micronas, PCIe TV Processors
152. MicroProbe, Inc., Mx-FinePitch (Mx-FP) Product
153. Microstaq Inc., Unique VentilumTMchip
154. Microtune??, Inc., Patent-pending ClearTuneTMtechnology
155. Mindray DS USA, New Premium M7 Portable Ultrasound System
156. Mindspeed Technologies, Inc., Transcede(TM) baseband device for
3G/4G/long-term evolution (LTE)
157. MIPS Technologies, Inc.,
First 40nm USB PHY IP core and First USB-certified 1.8v 45nm USB PHY IP core
158. MIPS Technologies, Inc., HDMI-based Solution for Digital Home
159. MIPS Technologies, Inc.,
MIPS32 4KEc Core for Use in Breakthrough Stream Processor Architecture
160. Micrel Inc., High Side Load Switches
161. Mistletoe Technologies, Inc.,
LAN-Based Traffic Encryption Products
162. MoSys, Inc., 1T-SRAM Technology
163. MoSys, Inc., High-Performance Solid-State Storage Solutions
164. MoSys, Inc., 1T-SRAM(R) Technology for Its Leading-Edge 65nm
Semiconductor Manufacturing Process
165. mPhase Technologies,
First Stage of Planned Triple-Axis Prototype Magnetometer
166. NEC Electronics, Virtual PC-Class Thin Client System
167. NeoMagic Corporation, Dynamic Random-Access-Memory (DRAM)
Technology and on-chip semiconductor memories
168. Nethra Imaging, Inc., Palladium II system
169. NEXX Systems, Inc., High Density 3D through-silicon-vias (TSVs)
170. Novas Software, Inc., Siloti Replay technology
171. Novelics, MemQuestTM
172. Numonyx B.V., Phase Change Memory Technology
173. NVIDIA Corporation, 3D VISION Surround Technology
174. NXP, GPS/GSM-based Toll System
175. Oasys Design Systems, New Chip Synthesis(TM) Platform
176. Oasys Design Systems, Synthesizes 100-Million-Gate Chips
177. Objective Interface Systems, Inc.,
ORBexpress(R) Communications Middleware
178. ON Semiconductor, XPressArray-II (XPA-II)
179. ON Semiconductor, New ESD9L/Electrostatic Discharge(ESD)
Protection Device
180. OpenPages, Sarbanes-Oxley Express (SOX Express)
181. Palmchip Corporation, GMinutes’ iPhone Web application
182. Panasonic Corporation, Leading-Edge SoC Process Technologies
183. Patriot Scientific Corp., Moore Microprocessor Patent(TM) Portfolio
184. Phase One A/S, Sensor+ CCD Technology
185. Pixelworks, Inc., New Generation of ImageProcessor ICs Products
186. Planar Systems, Inc., Clarity RP and RX Rear-projection Displays
187. Provigent, 4G Backhaul System-on-a-Chip
188. Provigent
189. Qualcomm Incorporated, Snapdragon(TM) chipset platform
190. Rambus Inc., Mobile XDR(TM) memory architecture
191. Rambus Inc.,
Cell Broadband Engine(TM)-Based Processors and Companion Chips
192. Real Intent Software,
Verification Software With World-Class Debug Software
193. Real Intent, Inc., Meridian CDC(TM) Software
194. Redpine Signals, Inc.,
Lite-NMAX(TM) product-Mobile WiMAX(R) convergence solution
195. RedShift Systems, Thermal Light ValveTM(TLV) Technology
196. Renesas Electronics Corporation,
Next Generation SoCs for HDD and solid state drive (SSD) storage
197. Renesas Technology Corp., SuperH Microcontroller
198. Renesas Technology Corp.,
200MHz SuperH Chip for Powertrain Systems
199. RF Digital, World's First Wi-Fi(R) Module
200. RFaxis, RF Front-end Integrated Circuits
201. Royal Philips Electronics,
Right-First-Time 65-nm System-on-Chip (SoC)
202. Samsung Electronics, Co., Ltd, High-K Metal Gate Logic
Process and Design Ecosystem
203. Sandbridge Technologies, SB3000(R) series SOC platform
204. Sarnoff Corporation,
Acadia II Vision Processor for Next-Generation Embedded Systems
205. Sarnoff Corporation, High Performance,
Low Energy Consumption SoC to Power Next-Gen Vision Systems
206. Scintera Networks, Inc, Adaptive RF Power Amplifier Linearizer
(RFPAL) system-on-chip (SoC)
207. Sensor System Solutions, Inc., Sensor Signal Conditioner
208. Sequans Communications, WiMAXsystem-on-chip Technology
209. Sequence Design, Inc., SMMART Technology
210. Shrink Nanotechnologies, Inc.,
ShrinkChip Rapid Prototyping System (RPS)
211. Sidense Corp., Embedded Non-Volatile Memory (NVM) Products
212. Sigma Designs, MIMO 기술을 사용한 혁신적 new ClearPath 기술
213. Sigma Designs, Inc., SMP8656 Secure Media Processor(TM)
for Android connected media player
214. Sigma Designs, Inc., VXP image-processing technology
215. Sigma Designs,
Z-Wave Solutions for Home Entertainment Networking
216. Sigma Designs, Inc.,
Revolutionary Powerline Communications Technology With MIMO
217. Sigma Designs, Advanced Video and Networking Technologies
218. SigmaTel Inc., System-on-chip Controllers
219. Silicon & Software Systems Ltd. (S3),
Leading-edge Mobile TV SoC
220. Silicon Image, Inc., Enhanced,
Scalable cineramIC(TM) Ultra High-definition Video Decoder
221. Silicon Storage Technology, Inc.(SST),
Single-chip, fully Integrated Mobile Platform Controller
222. Silicon Image, Inc., Port HDMI(TM) Receiver IP Core
223. Silistix, CHAINarchitect Bridges Gap
224. Silistix, Self-Timed Interconnect Technology
225. SiRF Technology, Inc., Global Locate GPS chips
226. Sonics Inc., System-on-chip (SoC) SMART Interconnect solutions
227. Sonics Inc., New Interleaved Multichannel Technology(TM)
228. Sonics Inc., SonicsMX?? SMART Interconnect(TM) Solution
229. Sonics Inc., Next Generation Mobileye Eye2 Product
230. Sonics Inc., Breakthrough in SystemC-based SoC Modeling
231. SPiDCOM Technologies, SPC300 "no-limits" HomePlugAV SoC
232. Spreadtrum Communications, Inc.,
New AVS Video / Audio Decoder Chip SV6100
233. ST-Ericsson, Symmetric Multi Processing (SMP)
234. STMicroelectronics,
32nm Design Platform for Next-Generation System-on-Chip ICs
235. STMicroelectronics, CMOS Image-Sensor Technology
236. STMicroelectronics, Cartesio+ Processor
237. STMicroelectronics, Certified Design Flow
238. STMicroelectronics, Complete Fully Integrated NFC
(Near Field Communication) System-on-Chip
239. STMicroelectronics, Next-Generation Integrated Bluetooth(R) and
FM-Radio Transceiver System on Chip
240. STMicroelectronics, Third-generation Digital Baseband Processors
241. STMicroelectronics, Wireless LAN Chip for Wi-Fi
242. STMicroelectronics, Innovative Network-on-Chip Technology
243. Sun Microsystems, Inc.,
Breakthrough UltraSPARC T2 CoolThreads(TM) Processor
244. Sunplus Technology, DVD SoC SPHE8281AV
245. Symwave, Inc., USB 3.0 Physical Layer Technology
246. Synfora, Inc, PICO Extreme-Breakthrough in Algorithmic
Synthesis Technology
247. Synopsys, Inc., High-level Synthesis Technology
248. Synopsys, Inc., PrimeTime SI
249. Synopsys, Inc., Leading-edge PCIe and RapidIO Chips
250. Synopsys, Inc., State-of-the-Art Timing
Analysis Technology for 45- and 32-Nanometer Process Nodes
251. Synopsys, Inc.,
DesignWare IP for USB 2.0, PCIe, SATA and XAUI PHYs
252. Synopsys, Inc., PSM Technology
253. Synopsys, Inc., Discovery(TM) Verification Platform
254. SysMaster Corporation, New DaVinci Chip
255. Teknovus, New EPON SoC
256. TeleCIS Wireless, Inc., 802.16-2004 SoC Chip
257. Tensilica, Inc., HiFi Audio DSP family
258. Tensilica, Inc., Xtensa Processor family and the
Diamond Standard Processor family
259. Tensilica, Inc., HiFi 2 Audio Engine
260. Teridian Semiconductor, Single Converter TechnologyTM
261. Texas Instruments, Cortex(TM)-A series processor core
262. Texas Instruments, DaVinci(TM) technology
263. Texas Instruments, Digital Media processor
264. Texas Instruments, OMAP2420 Applications Processor
265. Themis Computer, New P.A. Semi-Based PrXMC/PrPMC Module
266. Third-Order Nanotechnologies, Inc.,
Ultra-quick Computer Technology
267. Tilera Corporation, High Performance TILE64(TM) Processor
268. Toshiba America Electronic Components, Inc., System-on-a-chip
ICs for mass-market ATSC high- definition LCD TVs
269. Toshiba America Electronic Components, Inc., Unified TV Platform
270. Toshiba America Electronic Components, Inc.,
Next-Generation Graphics Display Controller
271. TotalView Technologies, TotalView(R) Debugger
272. TowerJazz, Copper-Based 130nm CMOS Logic Process
273. Trident Microsystems, Inc.,
Integrated 240Hz Frame Rate Converter Solution
274. Tundra Semiconductor Corporation, Serial RapidIO(R) Switches
275. UMC, World's Smallest Silicon Tuner Device
276. Verigy, V93000 SoC Test Platform
277. Verigy, V6000 Flash and DRAM Test Platform
278. Verigy, Inovys FaultInsyte Software
279. Verigy, Next-
generation Platform for SoC Design-V93000 Pin Scale system
280. Verimatrix, VideoMark(TM) User-
specific Forensic Watermarking Technology
281. VIA Technologies, Inc., Power Efficient VIA C7 x86 Processors
282. Virtutech, Inc., Hybrid Simulation Capability
283. Vitesse Semiconductor Corp.,
E-StaX-34(TM) Switch-on-a chip (SoC) Product
284. Vubiq, Inc., First 60 GHz Integrated Radio on a Chip
285. WhizChip Technologies, Leading-Edge,
Cost-Effective ASIC/SoC Design & Verification
286. Wind River Systems, Inc., Workbench On-Chip Debugging
287. WiNetworks, Win-Max(R) Pico
288. Wipro Technologies, European System on Chip (SoC)
Design Firm NewLogic
289. Xilinx, Inc., Real-Time 3D TV용 Platform
290. Xilinx, Stacked Silicon Interconnect technology
291. Xilinx, Virtex-6 HXT FPGAs
292. ZiiLABS, Stereoscopic 3D and OpenCL™ Technology
293. ZiiLABS, New ZMS-08 -based SiVO Digital Home Platform
294. ZiiLABS, Next Generation Smart/Media Phone Platform for Android
295. Zilog Inc., NEW ZMOTION™ DETECTION AND CONTROL
MODULE FEATURING ADVANCED SENSING TECHNOLOGY
296. Ziptronix, Inc., Direct Bond Interconnect 3D integration technology
297. Ziptronix, ZiBond™ low temperature covalent bonding
298. Zoran Corporation, Digital Camera Image Signal Processing (ISP)
299. Zoran Corporation, Activa 220 SOC
300. Zoran Corporation, Activa 200/250

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